Wafer Fab Equipment Model

A wafer fab model forecasts semiconductor equipment sales using a bottoms-up approach based on wafer capacity and process node requirements. The model provides detailed forecasts through 2027 for lithography equipment, wafer capacity for advanced logic and memory, and sales revenue for major vendors like ASML and Applied Materials. It covers advanced logic nodes down to 1.4nm-class processes, including technologies like GAA, backside power delivery, and high-NA EUV. The data also breaks down equipment sales by end-use segments such as leading-edge logic, DRAM, and NAND.